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Stress Measuring Instrument - メーカー・企業と製品の一覧

Stress Measuring Instrumentの製品一覧

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Resin Curing Shrinkage Stress Measurement Device "CUSTRON"

Temperature change measurement of resin surfaces is possible! A measuring device that does not require special measurement techniques.

"CUSTRON" is a resin curing shrinkage stress measurement device that can continuously measure the curing shrinkage rate and shrinkage stress associated with the curing of UV-curable resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, and more. The thermal profile of heating and cooling, such as UV irradiation → heating → cooling, can be freely combined and set through programming. It reproduces the shrinkage rate and shrinkage stress experienced by products subjected to various heats during the manufacturing process or placed in different environments over a long period. 【Features】 ○ Continuous measurement of the entire process before, during, and after the reaction ○ Heat cycle measurement ○ Reproduction of environmental conditions ○ A sample volume of just 1cc is sufficient For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Guidewire Sliding Stress Measurement Device for Test Automation and Data Collection

Measuring the push and pull force of the guidewire!

With Protech's "Guide Wire Sliding Stress Measurement Device," you can measure frictional force by rotating the roller with a torque sensor on the hand side, pressing the guide wire into the template, and pulling it out. It is possible to continuously measure the pushing and pulling forces, and repeated back-and-forth measurements can also be conducted. The measurement results are displayed in real-time as graphs on a PC, and the measurement data can be saved in CSV file format. Additionally, parameters can be set as desired.

  • Testing Equipment and Devices

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Portable X-ray residual stress measurement device (new lineup μ-X360s)

The long-awaited compact version μ-X360s of the μ-X360 series has arrived! Capable of measuring [residual stress], [half-value width], and [residual austenite].

~ Achieving compactness, lightweight design, high-speed measurement, and excellent mobility! ~ The residual stress measurement device has evolved to this point! We have added the long-awaited compact version μ-X360s to the μ-X360 series. It non-destructively measures residual stress, residual austenite, and half-value width in metals and ceramics. It is an outstanding device in terms of portability, reliability, safety, operability, and price.

  • X-ray inspection equipment

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X-ray residual stress measurement device "μ-X360s"

Non-destructive, simple, and fast measurement of metal stress! Compact and lightweight, incredibly easy to use!

The "μ-X360s" is a portable measuring device that can non-destructively measure the stress of metals. Both setup and operation are simple, allowing for high-speed measurements in just 60 seconds each. Particularly for large structures, it can measure directly rather than using cut samples, which is helpful in identifying the causes of cracks and other issues. Using a shielding box, measurements can also be conducted without the need for an "X-ray work supervisor" qualification. It has received the "Academic Encouragement Award" from the Japan Non-Destructive Testing Association and the "Technical Development Award" from the Japan Society for Technology of Plasticity. ★ Free trial measurements are currently available ★ We are currently offering free trial measurements. Please contact us through the "Contact Us" section below. 【Features】 ■ Lightweight with a total weight of approximately 8.6 kg (sensor part: about 2.4 kg) and long-lasting battery ■ Capable of measuring the interior of pipes with an inner diameter of 170 mm ■ Utilizes the excellent cosα method for measurements ■ Air-cooled design *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • X-ray inspection equipment

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